Working Location: Remotely based in Malaysia
The Challenge
Drive sales in a fast-moving semiconductor packaging market while balancing technical and customer needs.
The Opportunity
Work closely with engineering and customers to deliver solutions and grow long-term partnerships.
Compensation and Benefits
Competitive and aligned with experience.
What You Will Do
The Opportunity
Work closely with engineering and customers to deliver solutions and grow long-term partnerships.
Compensation and Benefits
Competitive and aligned with experience.
What You Will Do
- Manage sales activities and achieve targets for packaging equipment
- Understand customer needs and align solutions with technical teams
- Track market trends to support business planning
- Coordinate with engineering, production, and after-sales teams
- Build and maintain strong customer relationships
Who We Are Looking For
Preferred Qualifications
- Bachelor’s degree or higher
- 5+ years in semiconductor packaging
- Exposure to Flip Chip, WLP, or 3D packaging is an advantage
- Identifying market opportunities, target segments, and effective lead generation strategies.
- Managing marketing activities, including market research and analysis, to support business growth.
- Strong communication and negotiation skills
- Willingness to travel
Skills and Attributes
Organised, responsive, and able to manage multiple priorities simultaneously
